C-mode Scanning Acoustic Microscope
What
is C-SAM?
System 3100 is C-Mode Scanning Acoustic Microscope (C-SAM)
that examines samples and produces high resolution, ultrasonic
images. The most technologically advanced, self-contained instrument
of its kind. In the laboratory or in quality control, C-SAM
is effective for the nondestructive testing of a wide range
of samples, including ceramics, metals, polymers, and other
composite materials. C-SAM reveals the internal features beneath
a sample's surface one plane at a time, enabling the discovery
of hidden defects. Its automatic focusing capability makes C-SAM
extremely sensitive to interfacial anomalies such as poor bonding,
delamination, voids, cracks, and foreign matter inclusions.
Outstanding Features
- A unique Very High Speed (VHS) scanner produces images in less than 9 seconds, orders of magnitude faster than other ultrasonic inspection systems
- Single depth automatic focus for the Z-axis
- A unique Acoustic Impedance Polarity Detector (AIPD) differentiates between high and low impedance materials at an interface
- A frequency range of 10-100 MHz provides for a wide range of penetration and resolution capabilities
- The built-in X-Y table accommodates large sample positioning over 10 inch square area.
Block Diagram of C-SAM
Time of Flight (TOF) 3-D acoustic image showing a crack profile
in a plastic leaded chip carrier (PLCC).
Q-BAM
Nondestructive cross-section of a plastic integrated circuit.
The top half of the display shows an interface scan at the paddle
surface. Red is disbonded. The bottom half is the cross-section
showing the die paddle, a void 230 microns above it and cracks
in the encapsulant extending up towards the surface. Each division
of scale equals 0.17 mm in depth.
Bond wires (grey) within a plastic dual in-line package (PDIP).
The grey spots are voids in the molding compound.
Companies interested in failure analysis of IC packages can discuss
their interests with
Professor Aris Christou.
Additional Resources
