ENMA 465: Microprocessing :
Course Description:
The course provides an overview of the microprocessing - and indeed nanoprocessing - of materials as used in the fabrication of ultrathin layers and structures of materials for use in semiconductors and other devices based on thin film fabrication. Key processes are explored with respect to their underlying chemistry and physics, the relation of these processes to resulting materials properties and microscale/nanoscale topography, the manufacturing equipment used to achieve success microprocessing, and fundamental interactions between process steps which determine the performance of micrstructures and nanostructures. Simulation exercises and research projects provide an opportunity to explore key concepts in the course, to develop useful modeling skills, and to actively pursue a research question in a team setting. The student will (1) develop skills in identifying, understanding, and exploiting fundamental mechanisms in microprocesses, and (2) gain a meaningful perspective on how this understanding can be used in industrial applications of microprocessing as employed in technologies for silicon ULSI, compound semiconductors, optoelectronics, displays, data storage, and microelectromechanical systems.
Prerequisites:
Required: permission of the instructor and ENES 230 (Introduction
to Materials and Their Applications) or equivalent
Recommended: ENMA 460 (Physics of Solid Materials) or equivalent
Course Objectives:
1. Provide an overview of thin film microprocessing, from chemical and physical fundamentals at the microscopic level to applications in microelectronics, nanotechnology, and other areas.
2. Identify and understand key concepts which transcend the various embodiments of microprocessing, so that students will be able to recognize the role of these concepts in diverse applications.
3. Demonstrate understanding of key concepts through group or individual projects.
Topics Covered:
Overview of semiconductor microelectronics processing; solids, surfaces, and length scales; device structures and process sequences for fabrication; vacuum technology and simulation for low-pressure processes; physical vapor deposition; surface and interface reactions; thermal oxidation; ion implantation and diffusion; thermal and plasma chemical vapor deposition; atomic layer deposition; lithography; plasma etching; interconnect technology; micoelectromechanical systems (MEMS); nanotechnology.
Textbook:
Silicon VLSI Technology: Fundamentals, Practice, and Modeling
James D. Plummer, Michael D. Deal, and Peter B. Griffin
Pentice Hall (2001), ISBN 0-13-085037-3
| Grading: | Homework |
15% 15% 15% 30% 25% |
Project Results:
Project results from 2002-2004 are available here for you to view.
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